BAE SYSTEMS Team Achieves Record Digital Circuit Speed
14 Apr 2004
A team led by BAE Systems has developed a next-generation transistor technology that improves speed, integration density and power consumption for solid state integrated circuits.
The team, composed of BAE Systems Information and Electronic Warfare Systems (IEWS), Vitesse Semiconductor Corporation, and the University of Illinois at Urbana-Champaign, recently demonstrated a circuit with a clock frequency of 152 GHz - an industry record for static frequency divider circuits. The indium phosphide (InP) heterojunction bipolar transistor (HBT) was developed under the Defense Advanced Research Projects Agency (DARPA) Technology for Frequency Agile Digitally Synthesized Transmitters (TFAST) program. The Army Research Laboratory, Adelphi, Maryland., has principal oversight of the program.
Dr. John Zolper, DARPA program manager and deputy director, Microsystems Technology Office, said, The demonstration of a 152 GHz static divider is a key milestone in developing circuit technology for establishing a new class of high-performance mixed-signal circuits for the Department of Defense.
DARPAs TFAST program seeks to significantly improve InP HBT micro-circuit performance and, at the same time, lower power consumption. Higher performance at lower power in more highly integrated packages will benefit DoD RF systems where limited weight and power requirements are crucial.
This is another piece to the technology puzzle that will be used to develop the next-generation of miniature digital receivers and exciters that are needed for future strike, surveillance, and electronic attack missions, said Frank Stroili, BAE Systems technology development manager. For example, this technology will enable the development of new subsystems such as low cost in-combat programmable electronic warfare (EW) jammers, expendable surveillance sensors, and frequency agile software radios for secure communications, he said.
Vitesse developed the VIP-2 InP HBT process used to manufacture the new, high-speed circuits designed by BAE Systems engineers. Research performed by the University of Illinois aided in the basic material and device scaling and understanding of the fundamental limits of the technology.
Using Vitesses VIP-2 semiconductor process, BAE Systems engineers designed the high-speed divider circuit and achieved the record breaking 150 GHz static operation. This accomplishment is both a significant technology breakthrough and an example of a successful partnership among DARPA, Tri-Services, industry, and academia, said Aaron Penkacik, BAE Systems vice president of Advanced Systems and Technology and Chief Technical Officer in Nashua, N.H.
BAE Systems received the $5.9 million DARPA contract in 2002.
About BAE SYSTEMS
BAE Systems is an international company engaged in the development, delivery, and support of advanced defence and aerospace systems in the air, on land, at sea, and in space. The company designs, manufactures, and supports military aircraft, surface ships, submarines, radar, avionics, communications, electronics, and guided weapon systems. It is a pioneer in technology with a heritage stretching back hundreds of years. It is at the forefront of innovation, working to develop the next generation of intelligent defence systems.
BAE Systems has major operations across five continents and customers in some 130 countries. The company employs more than 90,000 people and generates annual sales of approximately $19 billion through its wholly owned and joint-venture operations.
BAE Systems North America is a high-technology U.S. company employing more than 25,000 people who live and work in some 30 states, the District of Columbia, and the United Kingdom. The company is dedicated to solving its customers needs with highly innovative and leading edge solutions across the defence electronics, systems, information technology, and services arenas.
BAE Systems Information & Electronic Warfare Systems employs 5,700 people at 10 major facilities in eight states. The business unit is a major producer of aircraft self-protection systems and tactical surveillance and intelligence systems for all branches of the armed forces. Other major business areas include microwave, mission and space electronics; infrared imaging; and automated mission planning systems.
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